发明名称 Substrate processing apparatus
摘要 <p>A substrate processing apparatus (1) comprises a substrate transfer section (10), connection modules (300) attached to the substrate transfer section (10), and a first substrate transfer robot (20) in the substrate transfer section (10) capable of transferring substrates (5) to the connection modules (300). The connection module (300) comprises a substrate processing chamber (56), first and second intermediate chambers (54, 52) between the substrate processing chamber (56) and the substrate transfer section (10). The second intermediate chamber (52) is provided with a first substrate holder (70), the substrate processing chamber (56) is provided with a second substrate holder (90), and the first intermediate chamber (54) is provided with a substrate transfer device (80) capable of mounting a plurality of the substrates (5) held being stacked in the vertical direction by the first substrate holder (70), onto the second substrate holder (90) such that the substrates (5) are arranged side by side in the horizontal direction. The invention provides a substrate processing apparatus having a high substrate processing efficiency and a high throughput. <IMAGE></p>
申请公布号 EP0833374(A2) 申请公布日期 1998.04.01
申请号 EP19970115096 申请日期 1997.09.01
申请人 KOKUSAI ELECTRIC CO., LTD. 发明人 SUDA, ATSUHIKO;TOYODA, KAZUYUKI;MAKIGUCHI, ISSEI;OZAWA, MAKOTO
分类号 B65G49/07;H01L21/02;H01L21/677;H01L21/687;(IPC1-7):H01L21/00;B25J9/10 主分类号 B65G49/07
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