| 摘要 |
<p>PROBLEM TO BE SOLVED: To simplify a manufacturing process, and to improve production efficiency by suitably treating a plurality of circuit boards. SOLUTION: An anisotropic conductive bonding agent layer 20, consisting of conductive particles dispersed into thermosetting or thermoplastic resin material, is formed corresponding to a semiconductor chip mount region on the surface where the electrode terminal junction part 120 is provided on the band- like board 1 where an electrode terminal junction part 12a is provided in the same arrangement as the electrode terminal 32 formed on the semiconductor chip 30 inside a semiconductor chip mounted region. Then, this anisotropic conductive bonding agent layer 20 is softened, the semiconductor chip 30 is made to face to an electrode terminal 32 and the above-mentioned electrode junction part 12a, the electrode terminal 30 and the electrode terminal junction part 12a are electrically connected through conductive particles 22 by pressing the anisotropic conductive bonding agent layer 20, and they are integrally connected to the circuit board 10.</p> |
