发明名称 Fired body for manufacturing a substrate
摘要 A fired body for manufacturing a substrate is pillar-shaped and includes metallic wires arranged inside the fired body in parallel with its axis. The melting point of the metallic wires is higher than the melting point, pour point or softening point of an insulating base body of the fired body. A method of manufacturing a substrate includes the steps or: forming a pillar-shaped unfired body in which metallic wire rods having a melting point higher than the firing temperature of a fired body are embedded inside and in parallel with the axis; firing the unfired body at a temperature higher than the melting point of the fired body; and cutting the fired body in a direction perpendicular to the axis and to a predetermined thickness.
申请公布号 US5733640(A) 申请公布日期 1998.03.31
申请号 US19950493616 申请日期 1995.06.22
申请人 SHINKO ELECTRIC INDUSTRIES, CO., LTD. 发明人 HORIUCHI, MICHIO;TAKEUCHI, YUKIHARU;HARAYAMA, YOICHI
分类号 C04B35/00;H01L21/48;H01L23/12;H01L23/15;H01L23/498;H05K1/03;H05K3/00;H05K3/40;(IPC1-7):B32B3/00;H01R43/02 主分类号 C04B35/00
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