| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized oxygen electrode easy to be handled and difficult to be damaged by connecting a lead plate to a connection pad on an electrode substrate, covering a connection part of the connection pad and the lead plate with a mold resin body. SOLUTION: The lower end of a sensor chip 102 is covered with a mold resin body 126, and a pair of lead plates 115a, 115b are protruded from the lower face of the mold resin body 126. If a measuring person grips the mold resin body 126 and/or the lead plates 115a, 115b, useless stress does not occur in a sensor chip 102. Connection pads PA, PK are formed on the lower side of an oxygen permeable film 114. The lead plates 115a, 115b are connected to the upper face of the connection pads PA, PK. Even if stress is applied to the lead plates 115a, 115b, the stress is absorbed in the mold resin body 126, and direct application of the stress is prevented on the sensor chip 102. Thus, even if a member easy to be damaged of silicon plate and the like is used as the sensor chip 102, damage of the sensor chip is prevented. |
