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发明名称
Method for manufacturing prepackaged molding compound for component encapsulation
摘要
申请公布号
SG46940(A1)
申请公布日期
1998.03.20
申请号
SG19950000374
申请日期
1995.05.02
申请人
TEXAS INSTRUMENTS SINGAPORE (PTE) LTD.;BDM NEDERLAND BV.
发明人
BOLANOS, MARIO, A.;LIBRES, JEREMIAS, L.;MOON OW CHEE;CHEE TAY LIANG;PAS, IRENEUS, J., T., M.
分类号
B29C45/14;H01L21/56;(IPC1-7):H01L21/56
主分类号
B29C45/14
代理机构
代理人
主权项
地址
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