| 摘要 |
PURPOSE:To multiply a memory capacity two or more times with respect to an identical mounting area by a method wherein two or more film-carrier semiconductor modules are piled up and are connected electrically and a spacer is laid between these film carriers. CONSTITUTION:A bump 4a and a film carrier tape 6a are connected electrically by using an inner lead part 10a. The surface and the side of a semiconductor chip 2a are coated with a protective coating resin 14a. A surface pattern 22a and a rear pattern 24a are formed on a spacer 20a and are connected electrically by means of a through hole 26a. The surface pattern 22a and an outer lead 12a are connected electrically by means of a first connection layer 16a; a semiconductor module 28a is formed. A semiconductor module 29a of the same constitution is piled up; these are connected electrically by means of a second connection layer 18b. In the same manner, semiconductor modules 28c, 28d are piled up one upon another. |
