发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To increase the operating speed of a semiconductor device by reducing the wiring capacity of the device and to make a redundancy process easier, and then to stabilize the threshold voltage of a MOSFET by providing a wiring layer, consisting of a lower layer composed of polysilicon non-doped or having a resistivity of a specific value or higher and an upper layer composed of a metal silicide. SOLUTION: A first wiring layer, consisting of a lower layer composed of polysilicon 63 and 64 containing impurities at high concentrations and an upper layer composed of a metal silicide 11 having a first film thickness, is formed in the first area of a semiconductor substrate 1 with an insulating film in between. In addition, a second wiring layer consisting of a lower layer, composed of polysilicon 6 non-doped or having a resistivity of 10Ω.cm or higher and an upper layer composed of a metal silicide 10 having a second thickness thicker than the first film thickness is formed on the second area of the substrate 1 with an insulating film 5 in between. The silicide layer 10 formed on the non-doped polysilicon 6 grows to a thick flat layer, since no such impurity that suppresses silicification exists in the polysilicon 6.
申请公布号 JPH1074846(A) 申请公布日期 1998.03.17
申请号 JP19970144391 申请日期 1997.06.03
申请人 TOSHIBA CORP 发明人 ASAMURA TAKESHI
分类号 H01L21/28;H01L21/3205;H01L21/8238;H01L23/52;H01L27/092;H01L29/78;(IPC1-7):H01L21/823;H01L21/320 主分类号 H01L21/28
代理机构 代理人
主权项
地址