发明名称 ELECTROLESS PLATING DEVICE AND PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain good plating free from blobs and unequalness by providing the entire part of the bottom of a plating cell with a fine air bubble generating source and an atm. foam generating source in the upper part of this source. SOLUTION: The bottom of the plating cell 1 is provided with the air bubble generating source 2 consisting of a perforated board made of a fluororesin for generating fine air bubbles of a diameter of 5 to 100μm over the entire part thereof and is provided with the air bubble generating source 3 having holes 3A for generating the large bubbles of a diameter of 1 to 3cm apart a distance of about 10cm in the lower part of a piping above this source. As a result, a plating liquid 5 is forcibly stirred and the air bubbles are dispersed and are made uniform so that the concn. of dissolved oxygen is maintained at 2 to 4ppm. In such a case, the ventilation quantity of the fine air bubbles is specified to 1 to 21/min of plating liquid 11 and the ratio of the fine air bubbles to the atm. foam is preferably specified to 2:1. The application of the plating which is free from the blobs and unequalness and has the improved quality is thus made possible.
申请公布号 JPH1072678(A) 申请公布日期 1998.03.17
申请号 JP19960229127 申请日期 1996.08.29
申请人 NEC TOYAMA LTD 发明人 HOTTA SHINICHI
分类号 C23C18/16;C23C18/40;H05K3/18;(IPC1-7):C23C18/40 主分类号 C23C18/16
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