| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain chips with little chipping and improve the yield of nondefective products in chip production by using a wafer-holding film for dicing prepd. by coating a specific film substrate with a certain self-adhesive. SOLUTION: This wafer-holding film is prepd. by coating a film substrate having a tensile modulus of 19.0MPa or higher and a thickness of 50-350μm with a 0.2-25μm-thick self-adhesive layer having a dynamic viscoelastic modulus of 8×10-10×10Pa. The figure shows the cutting operation in dicing seen from the upper side. When a water 10 is cut as a certain cutting point with a rotary wheelstone 7, cutting processed while chattering the wafer 10 delicately in the up-and-down and right-and-left directions and thus various large and small crazes appear as shown by a cutting line. Such crazes are decreased by using the holding film prepd. as above. Examples of the substrate are PET, OPP (biaxially oriented PP film), and PC. The self-adhesive used is an acrylic one, e.g. a commercially available one being usable.</p> |
