| 摘要 |
<p>An adjustable pressure mount heatsink subassembly (10) is provided for use with an electronic chip component (16). The system (10) includes a heatsink portion (12) having a block (28) which has formed thereon to extend the lateral dimension of the circuit board portion (20) of the chip component (16). A mounting subassembly (14) is disposed substantially within the transverse channel (34) centrally located in a pretensioned arc portion (46) and a pair of opposed end portions (48) for engaging the circuit board portion board edges (26). The pressure of attachment is adjusted by a threaded screw (42) which extends through the threaded aperture (44) and engages the channel floor (36) of the heatsink block (28).</p> |
