| 摘要 |
The improved water-soluble photosensitive resin composition comprises a high-polymer compound represented by the general formula(I): <IMAGE> (I) (where X is Na, K or NH4) and a water-soluble polymer which is either polyvinylpyrrolidone or a copolymer of vinylpyrrolidone and vinylimidazole or both. The composition is applied to a substrate, exposed through a mask pattern and developed to form a photocured pattern and, thereafter, a light absorber is applied to the entire surface of the substrate and dried, followed by stripping away the photocured pattern and the overlying light absorber to form a black matrix pattern. The composition is suitable for use as a photoresist in the manufacture of black matrices as on color CRTs and capable of efficient formation of photocured patterns with high sensitivity by shorter times and lower intensities of exposure. In addition, the composition adheres strongly to glass substrates and is capable of pattern formation as thin film that is faithful to the mask pattern used.
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