| 摘要 |
<p>PROBLEM TO BE SOLVED: To lessen a leakage current which flows through a wafer supported by an electrostatic chuck and contaminating particles attached to the rear of the wafer, by a method wherein a wafer separating mask equipped with support members deposited on an insulating material area on the support surface of a chuck is provided. SOLUTION: An insulating material 113 is deposited on each of prescribed regions on a chuck surface 102, and furthermore separating mask materials are deposited as pads 112 to form a separating mask 100. The separating mask 100 is formed of material which is higher in abrasion resistance and adaptability and forms fewer particles than the surface material of a chuck. Then, the separating mask 100 holds a wafer 116 on the pad 112 so as not to make particles 110 on a pad 112 come into contact with the surface of the wafer 116. The pad 112 is easily cleaned, and the surface of the pad 112 coming into contact with the wafer 116 is ensured of being substantially free from contaminant. Furthermore, contaminants are entrapped in a space between pads.</p> |
