ELECTRONIC COMPONENT PACKAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component packaging device provided with a transfer head capable of using even a large-sized collet without disturbance in the electronic component packaging device for transferring and mounting many kinds of large and small various chips to a board by using the transfer head of a multi-collet type. SOLUTION: The transfer head 40 is provided with a rotator 41, a plurality of nozzle shafts 48 are inserted for vertical movement to the upper flange 41a and lower flange 41b of the rotator 41 and a collet 49 is provided on the lower end part of the nozzle shaft 48. A small gear 60 mounted to the lower part of the nozzle shaft 48 is engaged with the internal tooth of a ring-like large gear 6a and a driving gear 64 is engaged with an external tooth. A collet 49 is selected by horizontally rotating the rotator 41 by a motor 43 for collet selection and the chip 9 vacuum-sucked by the collet 49 isθ-corrected by rotating the driving gear 64 by aθcorrection motor 65.