| 摘要 |
PROBLEM TO BE SOLVED: To use the external surfaces of a polygonal transportation chamber for the other purpose than cooling by installing a wafer transporting mechanism which transports wafers between cassette chambers and reaction chambers in the transportation chamber and providing a cooling table within the turning radius of the waver transporting mechanism. SOLUTION: Two cassette chambers 1A and 1B are respectively provided on the two continuous external surfaces of a polygonal transportation chamber 5 and two reaction chambers 2A and 2B are provided on another two continuous external surfaces. A wafer transporting mechanism 4 which transports wafers 3 between the chambers 1A and 1B and 2A and 2B is provided in the chamber 5. Then, for example, two cooling tables 6 are provided at positions higher than the turning plane of the mechanism 4 at cooling time within the turning radius R of the mechanism 4 and, at the same time, the elevating/lowering shaft 8 of the mechanism 4 is vertically erected on the mechanism 4 or tables 6. Therefore, the external surfaces of the chamber 5 which have been used for cooling the chamber 5 can be used for other purposes and the function of an individual wafer type semiconductor manufacturing device can be improved. |
