| 摘要 |
PROBLEM TO BE SOLVED: To enhance mounting density of a circuit on both surfaces and a multilayer printed wiring board by providing a groove on an insulating layer as well as by performing metal plating on the wall surface of this groove so as to form a circuit. SOLUTION: A printed wiring board where, as in the case of an antenna circuit, the circuits 11, 12 on both sides of an insulating layer 1 are connected through an interlayer circuit in the same circuit, in order to reduce the phase difference of signals a through-groove 10 is dug in the insulating layer 1 along the circuits 11, 12 of the objects of connection by laser machining and plating of this wall surface with a metal 13, so as to integrate the fellow circuits. In this case, the groove is provided with an extremely minute width so that the groove is buried with the thickness of the metal provided on the groove wall surface by plating. This allows a circuit which conventionally exist only on both sides of the insulating layer to be provided also inside thereof. |
