| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming bump with which a ball at the lower end part of a wire can be strongly bonded to the electrode of a work and the lower face of the ball (bump) is not damaged. SOLUTION: After a ball 14 is formed by approaching a torch 36 to the lower end part of a wire 13 led from a capillary tool 12, the capillary tool 12 is moved down and the ball 14 is engaged into the lower terminal part of central hole of the capillary tool 12. Next, the wire 13 is strongly clamped by a cut clamper 28, the capillary tool 12 is moved down, and the wire 13 is cut. The capillary tool 12 is further moved down and the ball 14 is pressed and bonded to an electrode 10a of a chip 10. Afterwards, the presser of a presser jig is pressed against the tail protruded form the bump (ball) 14, the tail is squashed and the height of the bump 14 is made uniform. |
