Vorrichtung zur Montage von elektronischen Bauteilen auf einer Leiterplatte
摘要
A printed circuit board component mounting device characterised in that it comprises: a sheet-metal member having a head portion formed to be locatable in a slot of a component to be mounted by the device on a printed circuit board; and a base portion formed to be locatable in an aperture in the board and partially extend therethrough to be soldered to a reverse surface of the board to retain said member on the board for locating a component thereon. <IMAGE>
申请公布号
DE69316709(D1)
申请公布日期
1998.03.05
申请号
DE1993616709
申请日期
1993.11.02
申请人
REDPOINT THERMALLOY LTD., SWINDON, WILTSHIRE, GB
发明人
FISHER, FRANCIS EDWARD, SWINDON, SN5 9SG, GB;JOHNSON, ROBIN DOUGLAS, BA1 5SY,, GB;JORDAN, WILLIAM D, TEXAS 75205, US