发明名称 Vorrichtung zur Montage von elektronischen Bauteilen auf einer Leiterplatte
摘要 A printed circuit board component mounting device characterised in that it comprises: a sheet-metal member having a head portion formed to be locatable in a slot of a component to be mounted by the device on a printed circuit board; and a base portion formed to be locatable in an aperture in the board and partially extend therethrough to be soldered to a reverse surface of the board to retain said member on the board for locating a component thereon. <IMAGE>
申请公布号 DE69316709(D1) 申请公布日期 1998.03.05
申请号 DE1993616709 申请日期 1993.11.02
申请人 REDPOINT THERMALLOY LTD., SWINDON, WILTSHIRE, GB 发明人 FISHER, FRANCIS EDWARD, SWINDON, SN5 9SG, GB;JOHNSON, ROBIN DOUGLAS, BA1 5SY,, GB;JORDAN, WILLIAM D, TEXAS 75205, US
分类号 H05K3/30;H05K7/12;(IPC1-7):H05K7/12 主分类号 H05K3/30
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