| 发明名称 |
METHOD AND DEVICE FOR STACKING SUBSTRATES WHICH ARE TO BE JOINED BY BONDING |
| 摘要 |
<p>A method and an apparatus are proposed in order to bond multilayered substrate packages over a large surface at uniform heating in the course of one single work step, wherein the structured substrates are to begin with aligned to one another with high precision to correspond to the structuring in a working area separate from the heating apparatus.</p> |
| 申请公布号 |
EP0605679(B1) |
申请公布日期 |
1998.03.04 |
| 申请号 |
EP19930912950 |
申请日期 |
1993.06.11 |
| 申请人 |
MANNESMANN VDO AG |
发明人 |
PLANKENHORN, HORST;LINDNER, THOMAS |
| 分类号 |
H01L21/02;B32B17/10;B65G49/07;H01L21/98;H01L29/84;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/02 |
| 代理机构 |
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