SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME

摘要

A module structure and a manufacturing method suitable for manufacturing a semiconductor plastic package, especially, a power semiconductor module. An inexpensive highly reliable resin encapsulated power semiconductor module is fabricated using a board (6) with positioning holes for mounting other parts (1) such as a power semiconductor element, and comprising a substrate (4), heat dissipating plate (5), main terminals (2), control terminals (3), and the board (6) is encapsulated with a resin (7).