MEHRSCHICHTPACKUNG MIT EINER VERTIEFTEN HÖHLUNG FÜR EINEN HALBLEITER-CHIP

摘要

An electronic component package, including: a multilayer ceramic or glass-ceramic substrate formed of a stacked plurality of generally parallel signal and insulating layers, each of the signal layers comprising an electrically conductive pattern; a cavity in a surface of the substrate sized to accommodate an electronic component with a planar surface of the electronic component disposed substantially planar with the surface of the substrate; and a plurality of electrical conductors extending from the surface of the substrate to selected ones of the signal layers for connecting the electronic component to the signal layers. Thin film wiring is provided for connecting the electronic component to the substrate.