发明名称 |
Hovedsakelig blyfritt loddemetall, fremgangsmåte for preparering derav samt anvendelse av nevnte loddemetall |
摘要 |
A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder. |
申请公布号 |
NO337878(B1) |
申请公布日期 |
2016.07.04 |
申请号 |
NO20040000106 |
申请日期 |
2004.01.09 |
申请人 |
SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE LTD;QUANTUM CHEMICAL TECHNOLOGIES (S'PORE) PTE LTD |
发明人 |
CHEW KAI HWA;PAN WEI CHIH |
分类号 |
B23K35/26;C22C13/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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