| 摘要 |
FIELD: technological processes.SUBSTANCE: invention relates to activation of dielectric surface before chemical metal coating and can be used in radio engineering industry, instrument making and in making of printed circuit boards. Method includes application on surface of plastic activator at temperature of 30-40 °C from activating solution with following composition, g/l: cuprous chloride 60-100, hydrochloric acid 230-250, dimethyl formamide 615-660, resin-anionite ASD-4-5p 0.4-1, aminopropyltriethoxysilane AGM-9 30-40, two-stage drying of activated plastic at temperature of 40 °C for 5 minutes and then at temperature of 90°C for 5 minutes to produce polycrystalline film on surface of plastic. At that, activated plastic is treated for 2-3 minutes in acceleration solution withe following proportions, g/l: sodium hydroxide 300, formalin 15, and then thermally treated at temperature of 90 °C.EFFECT: invention provides activation of plastic surface before chemical metallization and enables avoiding from technological process of environmentally hazardous components and reducing number of steps in process.1 cl, 1 tbl, 4 ex |
