| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin group insulation bonding agent for a multi- layer printed wiring board which is fire-resistant, excellent in preservation stability, and can be cured quickly at such a high temperature as 100 deg.C or higher. SOLUTION: The insulation bonding agent has a structure wherein the part where repetition of bisphenol part is not brominated and the part brominated are bonded alternately, with a brominated phenoxy resin or brominated bisphenol type epoxy resin wherein bromination percentage is 20% or above and weight average molecular weight 10,000 or above, a bisphenol type epoxy resin whose epoxy equivalent is 500 or less, and an epoxy resin curing agent contained as mandatory components. |
