发明名称 |
Method of manufacturing a sealed thermoelectric module |
摘要 |
The present invention relates to a method for manufacturing a thermoelectric module which utilises the concept of solid-liquid interdiffusion bonding for both forming the metallization, interconnection and bonding between the thermoelectric elements and the electric contacts and the forming of a hermetically sealing of the thermoelectric module. |
申请公布号 |
NO20150216(A1) |
申请公布日期 |
2016.08.15 |
申请号 |
NO20150000216 |
申请日期 |
2015.02.13 |
申请人 |
TEGMA AS |
发明人 |
TOLLEFSEN TORLEIF ANDRÉ;ENGVOLL MARIANNE AANVIK |
分类号 |
H01L35/08;B23K20/02;H01L35/12;H01L35/32 |
主分类号 |
H01L35/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|