发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a simple fuse cut method by means of laser light. SOLUTION: The chemical connection of the material of a fuse element 13 is non-thermally cut and the fuse element 13 is cut by the excimer laser light 15 of ArF excimer laser light (wavelength = 193nm and photon energy = 148kcal/mol) having photon energy larger than the material Al (connection energy = 78.7kcal/mol) of the fuse element 13 or CU (connection energy = 80.5kcal/mol) and smaller than a base SiO2 film (Si-O connection energy = 191kcal/mol) 12, KrF excimer laser light (wavelength = 248nm and photon energy = 115kcal/mol) and XeCl excimer laser light (wavelength = 308nm and photon energy = 93kcal/mol).</p>
申请公布号 JPH1050852(A) 申请公布日期 1998.02.20
申请号 JP19960220504 申请日期 1996.08.02
申请人 NIPPON STEEL CORP 发明人 KONOGI HIDEKAZU
分类号 B23K26/00;B23K26/38;H01L21/82;H01L27/10;(IPC1-7):H01L21/82 主分类号 B23K26/00
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