| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device in which a contact of a bonding wire with an adjacent conductor is prevented and a distance to an external terminal is long but not thick by adhering a portion between an electrode of a semiconductor chip and the external terminal to a support plate for the chip with adhesive. SOLUTION: An IC chip placing surface of an island 2a is coated with adhesive to adhere an IC chip 1, and an Au ball 9 formed at an end of an Au wire 6 is bonded to an AL pad 5 of the chip 1. After a bonding head is moved upward, it is moved to an external terminal 2a side and moved down. The wire 6 is pressed to adhesive 4 by a wire retaining tool 11, and adhered to the island 2a. Thereafter, a bonding head is moved to an external terminal 2b side in the state that it is pressed by the tool 11, and wired on the island 2a. After it is horizontally moved until a capillary 7 is sufficiently approached to the terminal 2b, the tool 11 is raised, bonded to the terminal 2b, and it is then cut. |
