| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a substrate treating device and improve the reliability of the device. SOLUTION: The inside of an enclosure 11 is partitioned into three chambers in the vertical direction, and in the lowest housing chamber 12, a chemical unit which supplies the chemical required for the treatment of substrates is housed and piping is laid below the chemical unit. In the middle second housing chamber 13, a substrate treating unit which performs treatments such as the resist application, exposure, development, etc., on the substrates is housed, and in the uppermost third housing chamber 14, an electrical unit which controls the chemical unit and substrate treating unit is housed. |
