| 摘要 |
A rear light entry photodetector chip 10 is secured face-down with solder 17a, 17b on to the front face of a ceramic submount 20 provided with a pair of electrically conductive vias 21a, (21b, Fig3). A frame-shaped mass 17b of solder seals the chip to the submount to provide a hermetic enclosure protecting sensitive semiconductor surface areas of the photodetector chip where electric fields are liable to be present in the vicinity of a pn or metal/semiconductor junction. |
