INSULATION ADHESIVE FOR MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To obtain an interlaminar insulation epoxy resin adhesive which has flame retardancy and excellent storage stability and can rapidly cure at a temperature as high as 100 deg.C or above. SOLUTION: This adhesive essentially consists of a brominated bisphenol epoxy resin or brominated phenoxy resin (A) having a degree of modification of 20% or above and a weight-average molecular weight of 10,000 or above, a bisphenol epoxy resin (B) having an epoxy equivalent of 500 or below and an epoxy resin curing agent. The amount of A should be 55-90wt.% based on the total weight of A and B.