发明名称 Heat transfer device of a plate stack construction
摘要 A plate sandwich structure for a heat transfer device provides flow duct plate units alternately stacked upon one another having flow duct breakthroughs which extend between two lateral plate areas as well as with connection duct breakthroughs, which are arranged separately from the flow duct breakthroughs, and connection cover plate units having connection duct breakthroughs arranged at least in two lateral plate areas. The last named breakthroughs suitably overlap with equal-sided ends in a flow duct breakthrough of one adjoining lateral plate area as well as a connection duct breakthrough of a flow duct plate unit adjoining the other lateral plate area. This results in two separate flow duct systems which are capable of passing two fluids in a cross current, reverse current or direct current. The structure can be used, for example, as a high temperature battery cooling element.
申请公布号 US5718286(A) 申请公布日期 1998.02.17
申请号 US19960691897 申请日期 1996.08.01
申请人 BEHR GMBH & CO. 发明人 DAMSOHN, HERBERT;PFENDER, CONRAD
分类号 F28F3/00;B32B3/10;F28D9/00;(IPC1-7):F28F3/08 主分类号 F28F3/00
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