| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the generation of unnecessary resin flashes between a sealed part and a mold in the manufacture of a resin sealed electronic part such as a transistor, an LED or an IC. SOLUTION: In the transfer resin sealing method in which a cavity 3 into which resin is injected is formed in the state of clamping a base by top and bottom forces 14 and 1 and sealing resin is injected into the cavity 3 through runners 5 and 6 communicated with the cavity 3 from a given cull 4, elastic materials 8 and 9 such as rubbers are embedded protrudingly on the resin injection terminal side of the cavity 3 along the runners 5 and 6 on either one of parting faces of the top and bottom forces 14 and 1, and the top and bottom forces 14 and 1 are mold clamped, and then molten resin is injected from the cull 4 into the cavity 3 through the runners 5 and 6. |
