发明名称 Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
摘要 A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the overall printed circuit assembly.
申请公布号 US5719749(A) 申请公布日期 1998.02.17
申请号 US19940685425 申请日期 1994.09.26
申请人 SHELDAHL, INC. 发明人 STOPPERAN, JAHN J.
分类号 H05K1/14;H05K3/28;H05K3/32;H05K3/36;H05K3/46;(IPC1-7):H05K1/11;H01R23/72 主分类号 H05K1/14
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