发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the generated stress concentration of a resin in the end portion of an insulator whereon a large-sized element is made mountable, and to prevent the generation of a resin crack from the end portion of the insulator. SOLUTION: Interposing an electric insulator 7 between a semiconductor element 1 and leads 4 (4-1, 4-2,..., 4-i), the semiconductor element 1 is sealed with a resin 5. Both the semiconductor element 1 and the electric insulator 7 are rectangular. The electric insulator 7 is made of a softer material than the resin 5, and the dimension of the minor member side of the electric insulator 7 is made smaller than that of the semiconductor element 1, to locate the side surface of the outer edge portion of the electric insulator 7, in the inside of the side surface of the outer edge portion of the major member side of the semiconductor element 1. Also, the major member side of the semiconductor element 1 is the shorter distance side between the outer edge portion of the semiconductor element 1 and the opposite outer edge portion of the resin 5 to it in comparison with the minor member side of the semiconductor element 1, and the side surface of the outer edge portion of the electric insulator 7, which is present on the foregoing smaller distance side, is located in the inside of the side surface of the outer edge portion of the semiconductor element 1.
申请公布号 JPH1041456(A) 申请公布日期 1998.02.13
申请号 JP19970105642 申请日期 1997.04.23
申请人 HITACHI LTD 发明人 KAWAI SUEO;NISHIMURA ASAO;KITANO MAKOTO;MIURA HIDEO;YAGUCHI AKIHIRO
分类号 H01L23/50 主分类号 H01L23/50
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