SMART CARD CONTG. SEMICONDUCTOR DIE

摘要

PROBLEM TO BE SOLVED: To provide a thin smart card package. SOLUTION: A semiconductor die 301 of this smart card is set to about 0.004 in. to 0.007 in. (0.1016 to 0.1778mm) thick and disposed on or near the neutral plane (where the mechanical strain due to bending is nearly zero) 522 (e-e') to thereby improve the mechanical bending resistance and the radio frequency characteristics because of its small thickness.