| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a solder connection by interposing a thermosetting resin sheet, in which solder for electrically connecting a wire electrode provided on the surface of a substrate for mounting and an external lead provided to a tape carrier part is embedded, between the tape carrier part and substrate for mounting. SOLUTION: On the thermosetting resin sheet 10, the solder 9 is formed which electrically connects the external lead 4 of the tape carrier part and the wire electrode 8 of the substrate 7 for mounting. After the tape carrier part is mounted on the thermosetting resin sheet 10, the solder 9 is fused by a heat treatment such as reflow to solder the external lead 4 and wire electrode 8 together and at the same time, the thermosetting resin sheet 10 is hardened. Consequently, the tape carrier part and substrate 7 for mounting are united in contact and the external lead 4 of the tape carrier part is connected. Consequently, the reliability of the solder connection can be improved. |
