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发明名称
PLATING TREATMENT DEVICE FOR SUBSTRATE FOR IC PACKAGE
摘要
申请公布号
JPH1036996(A)
申请公布日期
1998.02.10
申请号
JP19960208886
申请日期
1996.07.19
申请人
SUMITOMO KINZOKU ELECTRO DEVICE:KK;SHIMONOSEKI MEKKI KK
发明人
MIYAZAKI TAKESHI;YAMAMOTO SHINYA;MATSUNAGA SHIGEHARU;HIRAYAMA YOJI
分类号
C25D5/12;C25D5/20;C25D21/10;H01L23/12;H05K3/24;(IPC1-7):C25D5/20
主分类号
C25D5/12
代理机构
代理人
主权项
地址
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