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发明名称
Wafer-stage temperature compensation for IC components
摘要
申请公布号
GB2309828(A8)
申请公布日期
1998.02.10
申请号
GB19970008597
申请日期
1995.11.07
申请人
THAT CORPORATION
发明人
HEBERT, GARY, K.
分类号
H03F1/30;H03G3/10;(IPC1-7):H03F1/30
主分类号
H03F1/30
代理机构
代理人
主权项
地址
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