| 摘要 |
PROBLEM TO BE SOLVED: To prevent the resin pressure load applied at the time of injection molding by mounting an IC module on a wide space, also mounting a protective frame covering the IC module on the upper side of the lower side of the base and also mounting the IC module and the protective frame on one of either a surface side lable or a back side label. SOLUTION: An IC module is bonded on a base 1c preliminarily, which is mounted on a label 3a forming a printed pattern or the like, and then the inside of the protective frame 2 is filled with IC sealing resin 7 by the potting method. Then the label 3a and the label 3b are positioned on the given positions in molds 20a and 20b, and then the molds 20a and 20b are closed, and molding resin is filled between the labels 3a and 3b. When the molding resin is cooled and solidified, the molds 20a and 20b are opened and a card is released. The IC module thus provided is used as a high quality card without cracking properties. |
