发明名称 METHOD AND EQUIPMENT FOR LASER BEAM MACHINING
摘要 PROBLEM TO BE SOLVED: To realize the cutting with excellent cut section without generating any inconveniences in machining caused by insufficient or excessive heat input at the machining start point. SOLUTION: In the initial irradiation of the laser beam 1, the irradiation power is rapidly transferred to the prescribed value by controlling the irradiation power through the control of the current of PW, etc., in order to charge the irradiation power capable of instantaneously burning and removing a work 9 so as to prevent the work 9 from being carbonized, and in order to complete holding of a working hole 6, the material of the work 9 is removed to the depth of 1/3 to 2/3 of its thickness with irradiation by the initial laser beam 1. The second and subsequent laser beam irradiation power is set to be lower than the previous value, and the irradiation power is controlled so that the residual part at the work starting point of the work with reduced heat capacity is drilled down without giving excessive heat input.
申请公布号 JPH1034362(A) 申请公布日期 1998.02.10
申请号 JP19960189634 申请日期 1996.07.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIROSAKI TATSUYA
分类号 B23K26/00;B23K26/08;B23K26/40;(IPC1-7):B23K26/00 主分类号 B23K26/00
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