| 摘要 |
PROBLEM TO BE SOLVED: To mold easily an SON(small outline non lead) package of high molding accuracy without generating resin flashes. SOLUTION: In a resin sealing method for an SON package formed by connecting electrically one end face of a lead 14 with an electrode of a semiconductor chip 10 in a chip face of the semiconductor chip and forming the other end side exposed to the outer face of seal resin for sealing the above-referred chip face as a connecting section with a fitted base or the like, a mold with a cavity recessed section for setting a product to be molded composed of the lead 14 bonded with the semiconductor chip 10 is used, and the product to be molded is set on the recessed section in the state of coating a mold face including the cavity recessed section of the mold with a release film 32 of required flexibility and heat resistance, while the mold face of the other mold to be combined with the above-referred mold is also coated with the release film 32, and the product to be molded is clamped and resin is filled in the cavity to carry out the resin sealing. |
