发明名称 Electrode manufacturing method for semiconductor device
摘要 The manufacturing method involves forming an insulation layer on a semiconductor substrate (11). A wolfram silicide layer (13) is formed on the insulating layer. Impurity ions are implanted in the wolfram silicide layer to form an impurity region in a lower region of the wolfram silicide layer. The method further involves carrying out a heat treatment of the substrate on which the wolfram silicide layer is formed. A second insulating layer is formed on the wolfram silicide layer. The layers are then structured to form a gate electrode in a given part of the substrate. Second impurity ions are implanted in the substrate. The gate electrode is used as a mask to form the source and drain regions.
申请公布号 DE19703223(A1) 申请公布日期 1998.02.05
申请号 DE19971003223 申请日期 1997.01.29
申请人 LG SEMICON CO., LTD., CHEONGJU, KR 发明人 BYUN, JEONG SOO, CHEONGJU, KR;LEE, BYUNG HAK, CHEONGJU, KR
分类号 H01L21/28;H01L21/285;H01L21/3205;H01L21/336;H01L23/52;H01L29/78;(IPC1-7):H01L21/283;H01L21/265;H01L21/324 主分类号 H01L21/28
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