| 摘要 |
A resin molding apparatus eliminates the need of using a resin molding material preformed into tablets, and can provide moldings which are less likely to generate voids. The molding apparatus comprises an upper mold, a lower mold having a cylinder, heaters for heating the upper mold and lower mold, a plunger slidable along an inner wall of the cylinder, a mold cavity formed between the upper mold and lower mold, a runner providing communication between a cylinder inner space to be filled with a resin molding material and the mold cavity, and a gate member movable between a closed state and an opened state of the runner. In the closed state of the gate member, the resin molding material charged is pressurized by the movement of the plunger while indirectly heated by the heaters so that air contained between particles is discharged outside through gaps and the like between the plunger and the cylinder. On the other hand, in the opened state of the gate member, the resin molding material substantially melted is pressurized by the plunger to be supplied to the mold cavity through the runner.
|
