发明名称 NEGATIVE PHOTORESIST COMPOSITIONS AND USE THEREOF
摘要 Heat-resistant negative photoresist compositions which comprise a polyamic acid and a photosensitizer consisting of a specific 1,4-dihydropyridine derivative and which are not only excellent in both sensitivity and resolution but also easily developable with aqueous alkali. The compositions are characterized by comprising a polyamic acid and 1,4-dihydropyridine derivatives of general formula (I) wherein Ar is an aromatic group having a nitro group at the ortho position; R<1> is C1-C5 alkylene; and R<2>, R<3>, R<4> and R<5> are each hydrogen or C1-C4 alkyl.
申请公布号 WO9804959(A1) 申请公布日期 1998.02.05
申请号 WO1997JP02605 申请日期 1997.07.28
申请人 NITTO DENKO CORPORATION;FUJII, HIROFUMI;HAYASHI, SHUNICHI 发明人 FUJII, HIROFUMI;HAYASHI, SHUNICHI
分类号 G03F7/004;G03F7/038;H01L21/027;(IPC1-7):G03F7/038 主分类号 G03F7/004
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