| 摘要 |
A semiconductor device (10) having a reduced die support area (24) includes a semiconductor die (11) having a plurality of bond pads (17) which are electrically coupled to a plurality of leads (16) by wire bonds (15). The die is supported solely by two cantilevered tie bars (20). Use of cantilevered tie bars decreases the total plastic-metal interface area in a plastic encapsulated device, thereby lessening the probability of internal delamination and package cracking. The cantilevered tie bars also permit a variety of die sizes to be used with the same leadframe design. Optionally, a power supply bar may be used to connect the two tie bars to provide an electrical bus for the device.
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