发明名称 HEATED-TYPE SUBSTRATE SUPPORT STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To improve a heated-type substrate support plate, which is used in a treating chamber, specially to make the heat characteristics of the plate enhance. SOLUTION: This substrate support plate has a groove for accepting a heating element 56. The element 56 is constituted of an outer covering 200, a heater coil 202 and a heat conduction filling material 204. This element 56 is formed into such a structure that after the element 56 is arranged in the groove, it is shrinked and the material 204 is turned into a compacted material on the periphery of the coil 202.</p>
申请公布号 JPH1032238(A) 申请公布日期 1998.02.03
申请号 JP19970102018 申请日期 1997.04.18
申请人 APPLIED KOMATSU TECHNOL KK 发明人 JOHN M WHITE;LALLY CHAN
分类号 H01L21/683;C23C16/458;C23C16/46;C30B25/10;C30B25/12;H01L21/00;H01L21/205;H01L21/687;(IPC1-7):H01L21/68 主分类号 H01L21/683
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