发明名称 |
TRAY FOR INTEGRATED CIRCUITS |
摘要 |
A tray for integrated circuits which is made from a thermoplastic resin composition comprising 100 parts by weight of a polyphenylene ether resin, 0.1 to 40 parts by weight of carbon fibers having a number-average fiber length in the range of 0.05 to 1.5 mm, and 0.1 to 50 parts by weight of a flaky inorganic filler having an aspect ratio of 20 or above, and which has a surface resistivity in the range of 10<1> to 10<1><2> OMEGA . This tray is excellent in conductivity and heat resistance and reduced in warpage. |
申请公布号 |
EP0564660(B1) |
申请公布日期 |
1998.01.28 |
申请号 |
EP19920922491 |
申请日期 |
1992.10.26 |
申请人 |
MITSUI TOATSU CHEMICALS, INC. |
发明人 |
UEKI, TORU;YOSHIMURA, MASAJI;KANEZAKI, KAZUHARU;IWATA, INEO;TAKIGUCHI, MINORU |
分类号 |
B65D85/00;B65D85/38;B65D85/86;C08J5/00;C08K3/34;C08K7/00;C08K7/06;C08K7/10;C08L71/12;H01L21/60;H01L21/673;H01L21/68;H05K13/00 |
主分类号 |
B65D85/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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