| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cleaving device which is capable of lessening pellets in fraction defective causing no damage to the cleavage plane of the pellet, where the cleaving device is used to divide a solid material such as a semiconductor wafer or the like into pellets by cleaving. SOLUTION: A cleaving device 1 is equipped with a cleaving roller 33 which is pressed down rolling on a solid material (wafer 35) to cleave it. At this point, a slave roller 13 moves at the same speed with the cleaving roller 33 substantially without slipping on a stationary rail 11. A circumferential speed synchronous system 3 which rotationally links the rollers 33 and 13 together so as to make them equal in circumferential speed is provided. Therefore, the circumferential speed of the cleavage roller 33 becomes equal to its traveling speed, and the cleavage roller 33 makes a rolling motion without slipping substantially.</p> |
