发明名称 |
Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices |
摘要 |
A cooling device for lowering the temperature of a heat-dissipating device. The cooling device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with the heat-dissipating device. During operation, heat flows from the heat-dissipating device into the heat-conducting substrate, where it is spread out over a relatively large area. A thermoelectric cooling material (e.g., a Bi2Te3-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. Application of electrical power to the thermoelectric material drives the thermoelectric material to pump heat into a second heat-conducting substrate which, in turn, is attached to a heat sink.
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申请公布号 |
US5712448(A) |
申请公布日期 |
1998.01.27 |
申请号 |
US19960598193 |
申请日期 |
1996.02.07 |
申请人 |
CALIFORNIA INSTITUTE OF TECHNOLOGY |
发明人 |
VANDERSANDE, IAN W.;EWELL, RICHARD;FLEURIAL, JEAN-PIERRE;LYON, HYLAN B. |
分类号 |
H01L35/16;H01L35/32;(IPC1-7):H01L35/04;H01L35/18;H01L35/30 |
主分类号 |
H01L35/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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