| 摘要 |
A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/ DEG C, which closely matches the coefficient of thermal expansion of the solder used on the circuit board components. |
