| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method wherein electronic components can be mounted on boards at a high speed while the boards are sent to a plurality of working stages with excellent workability. SOLUTION: A first board 1a and a second board 1b are carried along a carrying path N with a first holding part 71 and a second holding part 72 of a pickup and place head 6. A first work stage A, a second work stage B and a third work stage C are arranged on the side part of the carrying path N. The first board 1a and the second board 1b are carried between the carrying path N and the first work stage A, the second work stage B and the third work stage C, with a first movable table 12A, a second movable table 12B and a third movable table 12C which are constituted of an X table, a Y table and θ(rotation) tables. Positions of a first θ table 151, a second θ table 152 and a third θ table 153 are so adjusted by driving the X table that the gaps are made equal to a gap between a first holding part 71 and a second holding part 72. |
